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@AIInvestHK · 2026-10-13 02:15

CNBC Oct 12, from the DBS Asia Future Forward Conference in Singapore: Broadcom CEO Hock Tan said financing could become a bigger obstacle to AI expansion than shortages of semiconductors, memory chips, or electricity. He put capital ahead of the usual bottlenecks. Same remarks: compute demand still sits above what the industry can supply, and that gap could run through 2029 and maybe into 2030. Wafer shortages, he said, could ease by 2028 or 2029 as capacity comes on. Intel CEO Lip-Bu Tan made the same financing point, citing the cost of capital and saying that over the longer run people will want to see ROI. He does not expect a meaningful slowdown over the next two to three years. $AVGO $INTC Watch whether higher bond yields actually slow data-center debt packages, or private credit just keeps filling the hole.

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