At the 2026 IMPACT International Conference, Prismark presented an industry ou… · @semivision_tw · TwKit

@semivision_tw

At the 2026 IMPACT International Conference, Prismark presented an industry outlook covering the global packaging substrate market, AI infrastructure investment, advanced packaging technologies, and critical material supply chains. The analysis highlighted a fundamental shift in the industry’s growth model. Future expansion will no longer be driven primarily by higher shipment volumes. Instead, increasing package dimensions, greater interconnect density, higher substrate layer counts, and more sophisticated material requirements will become the principal drivers of market value. https://tspasemiconductor.substack.com/p/2026-impact-prismark-ai-reshapes

曝光 598 · 评论 0 · 点赞 2 · 书签 0