$GLW $TER $FORM 🚨 CO-PACKAGED OPTICS IS HEADING FOR VOLUME. 60 COMPANIES JUST … · @carrioresearch · TwKit

@carrioresearch

$GLW $TER $FORM 🚨 CO-PACKAGED OPTICS IS HEADING FOR VOLUME. 60 COMPANIES JUST PUBLISHED THE FIRST FIVE SPECS TO BUILD IT SUNNYVALE, Oct. 20 - The Advanced Photonics Coalition published its first five specifications and recommended-practice documents on Tuesday, alongside the Optica+APC PECC Summit. The coalition says the portfolio was developed by 60 member organizations to speed up high-volume, lower-cost photonics manufacturing for AI data centers, and to "remove implementation variations that add no market value" so buyers can source from more than one supplier. - System architecture overview for CPO: a reference roadmap from 64 logical optical interfaces per package in 2026 to 1,024 in 2029, where one interface is one fiber lane at one wavelength - CPO outlook and recommended practices: power, cooling, serviceability, and a fast control plane kept separate from slower management traffic for optical circuit switching - Silicon photonics test procedures for CPO: automated test at four stages, wafer, bar, die and packaged device - 4-core multicore fiber spec: four single-mode cores in a 125 µm cladding, 40 µm core pitch, for 500 m and 2 km data-center links - Silicon photonics manufacturing spec: coupling-loss design targets of 1.5 dB or less for high-performance parts and 3.0 dB or less for standard The detail inside the documents comes from Converge Digest's read of them. The 2029 figure is a roadmap target, reached in the document through more lanes, more engines and more wavelengths. Going from 64 to 1,024 means 16x more channels to test, fiber up and light. At the summit itself, NVIDIA's Dan Kuchta named supply, manufacturing throughput and test capacity as the priorities for putting CPO into production, according to Converge Digest's report from the room. That puts the test step squarely on Teradyne ($TER) and FormFactor ($FORM), two US-listed test names that tied up on Oct. 12 with silicon photonics on the list. I put the fiber spec next to what Corning ($GLW) launched at OFC in March. Its Multicore Fiber Solution packs four cores into the standard 125-micron cladding, the same footprint APC has now written down. So of the five documents, the fiber spec describes something already on a show floor, while the architecture roadmap runs out to 2029.

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